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TDA9536
7.5 NS TRIPLE HIGH VOLTAGE VIDEO AMPLIFIER
PRELIMINARY DATA
FEATURE
s s s s s s s s
TRIPLE CHANNEL VIDEO AMPLIFIER SUPPLY VOLTAGE: 110V TYPICAL RISE AND FALL TIMEs: 7.5ns TYPICAL BANDWIDTH: 50Mhz TYPICAL 80 VOLTS OUTPUT DYNAMIC RANGE LOW POWER CONSUMPTION WELL MATCHED WITH TDA9210 PREAMP FULL PIN COMPATIBILITY WITH TDA9535
DESCRIPTION
The TDA9536 is a triple video amplifier with high voltage Bipolar/CMOS/DMOS technology (BCD) for use in color monitor application. Used with TDA9210 preamp in DC coupled mode, it provides for a low component, high performance and cost effective system solution. Other features include 1024 x 768 displays, pixelclock frequencies up to 100MHz, and DC or AC coupling designs.
CLIPWATT 11 (Plastic Package) ORDER CODE: TDA9536
PIN CONNECTIONS
11 10 9 8 7 6 5 4 3 2 1
OUT3 GND3 IN3 VCC IN2 GND2 OUT2 VDD IN1 GND1 OUT1
Version 3.2
March 2000
This is preliminary information on a new product now in development. Details are subject to change without notice.
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TDA9536
BLOCK DIAGRAM
OUT1 GND1 1 2 VDD 4 VCC 8
OUT2 GND2 5 6
OUT3 GND3 11 10
TDA9536
Vref
Vref
Vref
3 IN1
7 IN2
9 IN3
ABSOLUTE MAXIMUM RATINGS
Symbol VDD VCC VESD High Supply Voltage Low Supply Voltage ESD Susceptibility Human Body Model, 100pF. Discharge through 1.5K EIAJ Norm, 200pF. Discharge through 0 Output Source Current (pulsed < 50s) Output Sink Current (pulsed < 50s) Maximum Input Voltage Minimum Input Voltage Junction Temperature Storage Temperature Parameter Value 120 17 2 250 80 80 15 - 0.5 150 -20 + 150 Unit V V kV V mA mA V V C C
IOD I OG V I Max VI Min TJ TSTG
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TDA9536
THERMAL DATA
Symbol Rth (j-c) R th (j-a) Parameter Junction-Case Thermal Resistance (Max.) Junction-Ambient Thermal Resistance (Typ.) Value 3 35 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
(VCC = 12V, VDD = 110V, Tamb = 25 C)
Symbol VDD VCC IDD ICC dVOUT/dVDD dVOUT/dTemp VOUT SATH VOUT SATL AVR E lin OS Lf g/g R IN BW Parameter High Supply Voltage (Pin 4) Low Supply Voltage (Pin 8) High Voltage Supply Internal DC Current Low Voltage Supply Internal DC Current High Voltage Supply Rejection Output Voltage Drift Versus Temperature for any Channel Max. Output Voltage Min. Output Voltage Typical Video Gain Linearity Error Overshoot Low Frequency Gain Matching Video Input Resistor VOUT = 50V, f=1MHz VOUT = 50V VOUT=50V, CLOAD=8pF RP=200, VOUT=20V VOUT=50V, CLOAD=8pF RP=200, VOUT=40V VOUT=50V, CLOAD=8pF RP=200, VOUT=20V f = 1 MHz f = 20MHz 2 VOUT = 50V 10 Test Conditions Min Typ 110 12 25 60 0.5 15 VDD - 6.5 11 20 5 5 5 8 % % % K Max 115 15 Unit V V mA mA % mV/C V V
VOUT = 50V VOUT = 80V I0 =-60mA, (1) I0 =60mA, (1) VOUT = 50V 17Bandwidth at -3dB
50
MHz
tR, tF
Rise and Fall Time
7.5
ns
Lf CT Hf CT Low Frequency Crosstalk High Frequency Crosstalk Note: 1
50 32
dB dB
Pulsed current width < 50s
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TDA9536
TYPICAL APPLICATION
PC Board Lay-out The best performance is obtained with a carefully designed HF PC board, especially for the output and input capacitors. Rise/fall time and bandwidth are measured on a 10pF load. The best rise/fall time and bandwidth results will be obtained with low Rp resistor value while the best CRT arcing protection will be obtained by a righ Rp resistor value. Finally a value between 150 and 200 is agood compromise. Power Dissipation The power dissipation is the sum of the DC and the dynamic dissipation. As the feedback resistors are integrated, the DC power dissipation (capacitive load) can be estimated by: PSTAT = VDD . I DD + VCC . ICC Figure 1. The dynamic dissipation in worst case (full bandwidth and black pixel/white pixel picture - Note 2) is: PDYN = 3 VDD . CL . VOUT(PP) . f . K where f is the video frequency and K the active line duration / total duration. Example: for VDD = 110V, VCC = 12V, VOUT = 40 VPP, IDD = 25mA, ICC = 60mA, fVIDEO = 40MHz, CL = 8pF and K = 0.72. We have: PSTAT = 3.47W and PDYN =3.04W Therefore: Ptot = 6.51W.
Note: 2 This worst thermal case must be considered only for TJmax calculation. Nevertheless, during the average life of the circuit, the conditions are very close to the white picture conditions.
VCC VCC 75 3 IN1
VDD 110V VDD
8
4
TDA9536
OUT1 RP 1 2 CL GND1 OUT2 RP 5 6 CL GND2 OUT3 RP 11 10 GND3 CL
75 7 IN2
75 9 IN3
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TDA9536
Figure 2. TDA9535/9536 - TDA9210 - Demonstration Board: Silk Screen and Trace (scale 1:1)
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B C D E
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R1 C1(1) 100pF
8V 5V
TDA9536
A
R20 100R 100R
Hs Out
R18 100R R4 2R7
C3
VsOut
4
5V
4
J1 100nF R2 15R 1 IN1 U2 2 ABL R29 R8 15R 3 IN2 GNDL VCC C6 5 IN3 C24 100nF GND2 6 R17 VDD
5V
D1 R30 BLK 20 FDH400 transientresponse optimisation S_R R6 11 120R
12V
U1 D2(2)
R11 2R7
110V
GRN
5V
1N4148
D3
R3 75R D4 L1 0.33uH 1N4148 C4 100nF OUT1 18 GND3 10 24R 8 C7(1) IN2 R14 47uF 120R R26(2) 39R C10(1) 100nF 250V /
110V
1N4148 C23 OUT3 R9 15R/33R 47pF 7 C8 9 IN3 R31 S_R L2 0.33uH
110V
HS 19
R7
150R
RED D5 C9(1) 100nF 1N4148 100nF OUT2 GNDP 15R/33R 4 R24 GND1 2 24R TDA9535/36 C13 100pF
5V
BLU 4 16 R33 C5(1)100nF 24R 47pF 3 IN1 OUT2 5 C18 4.7uF/ 150V R32 S_R L3 R22 120R R28 J10 10R J5 I2C
110V
12 11 10 9 8 7 6 5 4 3 2 1
110V
R5 75R VCCP 17 R13 15R/33R R12 C22(1) 100nF 6 GNDA VCCA OSD1 R21 2K7 47pF OUT1 1 OSD2 OSD3 TDA9210 1 2 3 4 C12 100pF FBLK 11 SCL 12 SCA 13 R19 2K7 C25 OUT3 14 15 7 8 9 10 15R
5V
D6
D7(2) FDH400 R15 150R
3
Video
5V
1N4148
3
R10 75R R16 2R7
D8
1N4148
D9(2) FDH400 R23 0.33uH Heater 12 GND 11 B 10 H1 H2 R C14 10nF/ 400V 9 8 F1(2) 150R
110V
12V
C17
2
8V
C16 47uF
2
5V
J16
C15 47uF
GND_CRT J7 C21 100nF/ 250V
G2 GND 1 G1
Notes: 1: All capacitorsfollowed by (1) are decoupling capacitors which must be connected as close as possible to the device
7
J8 C19 G1 R27 150R 5 C20 G1 4.7nF/1kV G 6
G2 10nF/ 2KV
F2(2)
1 2 3 4 5 Heater
47uF
J17
Power
Figure 3. TDA9535/9536 - TDA9210 - Demonstration Board Schematic
1 2 3 4 5 6 Vs Out
2: The purpose of all components followed by (2) is to ensure a good protectionagainst overvoltage(arcing protection)
F4(2)
Supply Hs Out
1
1
Title
CRT3 with TDA9210 + TDA9535/36
Size Document Number Custom Version 1.4 February 6,2000 1 Date: Wednesday,
B C D
Rev Sheet
E
1
of
1
A
TDA9536
PACKAGE MECHANICAL DATA
11 PIN - CLIPWATT
V
V1 H3 A C V2 V1 V1 V1 L2 L1 L V R3 D R1 R L3 R2 S H2 H1
R3
R3
B lead#1 G F G1
E
M1
M
G2
Dimensions A B C D E F G G1 H1 H2 H3 L L1 L2 L3 M M1 R R1
Millimeters Min. 2.95 0.95 1.30 0.49 0.78 1.60 16.90 18.55 19.90 17.70 14.35 10.90 5.40 2.34 2.34 1.45 3.20 3.30 3.40 Typ. 3.00 1.00 0.15 1.50 0.515 0.80 1.70 17.00 12.00 18.60 20.00 17.90 14.55 11.00 5.50 2.54 2.54 18.65 20.10 18.10 14.65 11.10 5.60 2.74 2.74 0.730 0.783 0.696 0.564 0.429 0.212 0.092 0.092 0.057 0.126 1.70 0.55 0.88 1.80 17.10 0.051 0.019 0.031 0.063 0.665 Max. 3.05 1.05 Min. 0.116 0.037
Inches Typ. 0.118 0.039 0.006 0.059 0.020 0.033 0.067 0.669 0.472 0.732 0.787 0.704 0.572 0.433 0.216 0.100 0.100 0.130 0.734 0.791 (3) 0.712 0.576 0.437(3) 0.220 0.107 0.107 0.134 0.066 0.021 0.034 0.071 0.673 Max. 0.120 0.041
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Millimeters Min. Typ. 0.30 0.50 0.65 0.70 10deg. 5deg. 75deg. "H3 and L2" do not include mold flash or protrusions Mold flash or protrusions shall not exceed 0.15mm per side. 0.75 0.025 Max. Min. Inches Typ. 0.012 0.019 0.027 10deg. 5deg. 75deg. 0.029 Max.
Dimensions R2 R3 S V V1 V2 Note: 3
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this public ation are subject to change witho ut notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics. (c) 2000 STMicroelectronics - All Rights Reserved Purchase of I2C Components of STMicroelectronics, conveys a license under the Philip s I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philip s. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www .st.com
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